Device testing apparatus

ABSTRACT

A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

[0001] This application is a divisional of co-pending application Ser.No. 09/448,303, filed on Nov. 24, 1999, the entire contents of which arehereby incorporated by reference and for which priority is claimed under35 U.S.C. §120; and this application claims priority of Application Nos.10-333,864 filed in Japan on Nov. 25, 1998, 10-364,356 filed in Japan onDec. 22, 1998, and 10-351,357 filed in Japan on Dec. 10, 1998 under 35U.S.C. §119.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a device testing apparatus fortesting IC chips and other electronic devices at a predeterminedtemperature, more particularly relates to a device testing apparatuswhich accurately controls the temperature of the electronic devices evenif the electronic devices generate heat on their own during the testingand thereby enables the electronic devices to be tested at the desiredtest temperature.

[0004] 2. Description of the Related Art

[0005] In the process of production of a semiconductor device etc., atester is necessary for testing the finally produced IC chip or otherdevice. As one type of such a tester, there is known an apparatus fortesting an IC chip at high temperature, ordinary temperature ortemperature conditions lower than ordinary temperature. This is becauseit is guaranteed as one of the features of an IC chip that it operatewell as high temperature, ordinary temperature, or low temperature.

[0006] In such a tester, the top of the test head is covered by achamber, the inside is made an air-tight space, an IC chip is coveyed onto the test head, the IC chip is pushed against the test head forconnection, and the IC chip is tested while maintaining the inside ofthe chamber at a certain temperature range. This type of test is used totest IC chips well and sort them into at least good chips and defectivechips.

[0007] Along with the increasingly higher speeds and increasingly higherintegration densities of IC chips in recent years, the heat generated bythe chips themselves at the time of operation becomes larger. Such heatis generated at the time of testing IC chips as well. Even if the insideof the chamber is maintained at a constant temperature, it is thereforebe difficult to test IC chips at the intended test temperature. Forexample, as much of 30 watts of heat is sometimes generated depending onthe type of the IC chip. In this way, when testing IC chips generatinglarge heat, no matter how much effort is made to hold the inside of thechamber at a constant temperature, it becomes difficult to test the ICchips in a prescribed range of test temperature. When unable to test ICchips at the prescribed test temperature, there is the problem that thereliability of the tests ends up falling.

[0008] Recently, therefore, effort has been made to develop testingapparatuses with temperature sensors attached to the suction heads forpicking up and holding the IC chips and pressing and holding themagainst the sockets of the test heads, measuring the temperature of theIC chips at the time of the tests, and blowing cooling air when the ICchips rise to more than a set temperature due to the heat they generate.

[0009] Some types of testing apparatuses, however, have the suctionheads attached to rotary arms which rotate along an infinite path. Intesters where the suction heads move in this manner, there is theproblem that when attaching temperature sensors to the suction heads,the electrical wiring from the temperature sensors becomes complicated.If the electrical wiring from the temperature sensors is formed byordinary electrical wiring, the electrical wiring will become twistedalong with the rotation of the rotary arm, so it is necessary to userotary joints or other special connectors in the middle of theelectrical wiring. Accordingly, the testing apparatus become higher inprice and the problem occurs of rotational wear at the rotary joints ofthe electrical wiring and of a decline in the durability.

[0010] Further, in the worst case, the cables of the temperature sensorsare liable to break due to movement of the suction heads. Further, in astructure using suction passages of the suction heads to blow coolingair to the IC chips, it is not possible to blow a sufficient amount ofcooling air to the IC chips and therefore not possible to deal withcases of a large amount of heat generated.

SUMMARY OF THE INVENTION

[0011] An object of the present invention is to provide a device testingapparatus able to accurately control the temperature of electronicdevices and test the electronic devices at a desired test temperatureeven if the electronic devices generate heat on their own at the time oftesting. Another object of the present invention is the provision of adevice testing apparatus able to apply a uniform temperature to a largenumber of electronic devices in a short time.

[0012] To achieve the objects of the present invention, according to afirst aspect of the present invention, there is provided a devicetesting apparatus comprising a connection terminal to which anelectronic device under test is detachably connected; a pusher forpushing the electronic device in the direction of the connectionterminal so as to connect the electronic device to the connectionterminal; and a cooling unit attached to the pusher for cooling theelectronic device.

[0013] According to a second aspect of the present invention, there isprovided a device testing apparatus comprising a connection terminal towhich an electronic device under test is detachably connected and acooling unit for directly or indirectly cooling the connection terminal.

[0014] According to a third aspect of the present invention, there isprovide a device testing apparatus comprising a socket having aconnection terminal to which an electronic device under test isdetachably connected and a cooling unit for directly or indirectlycooling the socket.

[0015] Preferably, the cooling unit includes an element for cooling byelectricity.

[0016] Alternatively, preferably, the cooling unit includes a coolingmedium blowing means for blowing a cooling medium around the electronicdevice.

[0017] Alternatively, preferably, the cooling unit includes projectionsor depressions for heat exchange for increasing the cooling efficiencyby blowing a cooling medium. The projections or depressions for heatexchange are not particularly limited, but are preferably heat absorbingand radiating members. As the heat absorbing and radiating members, forexample heat radiating fins may be mentioned.

[0018] In the device testing apparatus according to the first to thirdaspects of the present invention, even if an electronic device generatesheat on its own at the time of testing, the electronic device is cooledthrough the pusher, connection terminal, or socket, so the effect ofheat generated by the electronic device is canceled out and it ispossible to test an electronic device at a predetermined temperature asstipulated in the specifications.

[0019] Note that when testing an electronic device at ordinarytemperature, it is possible to eliminate the test chamber. When testingthe electronic device at a low temperature, however, if just holding theelectronic device in a low temperature state, condensation sometimesbecomes a problem, so it is desirable to use a test chamber to cover thearea around the connection terminals to which the electronic device isdetachably connected. Further, when testing an electronic device at ahigh temperature, the present invention is effective from the viewpointof control of the temperature of the electronic device so that it doesnot exceed a predetermined temperature.

[0020] According to a fourth aspect of the present invention, there isprovided a device testing apparatus comprising a socket having aconnection terminal to which an electric device under test is detachablyconnected; a pusher for contacting a first surface of an electronicdevice and pushing the electronic device in the direction of theconnection terminal so as to connect the electronic device to theconnection terminals; a temperature sensor arranged at the socket sidefor measuring the temperature of a second surface of the electronicdevice at a side opposite to the first surface; and a cooling mediumblowing means for blowing a cooling medium around the electronic device.

[0021] The temperature sensor is not particularly limited and may be anyof a thermocouple, thermistor, or other contact-type temperature sensorfor detecting temperature in contact with a portion to be measured fortemperature or a radiation thermometer or other non-contact typetemperature sensor using infrared rays or the like to be able to detecttemperature by a non-contact method.

[0022] According to a fifth aspect of the present invention, there isprovided a device testing apparatus comprising a socket having aconnection terminal to which an electronic device under test isdetachably connected; a pusher for contacting a first surface of theelectronic device and pushing the electronic device in the direction ofthe connection terminals so as to connect the electronic device to theconnection terminal; and a cooling medium blowing means arranged at thesocket side for blowing a cooling medium to a second surface of theelectronic device at the side opposite to the first surface.

[0023] According to a sixth aspect of the present invention, there isprovided a device testing apparatus comprising a socket having aconnection terminal to which an electronic device under test isdetachably connected; a pusher for pushing the electronic device in thedirection of the connection terminals so as to connect the electronicdevice to the connection terminal; and a cooling medium blowing meansarranged at the outer circumference of the pusher for blowing a coolingmedium to a side surface of the pusher.

[0024] In this case, preferably projections or depressions are formed atthe outer circumferential surface of the pusher for increasing the heatexchange efficiency.

[0025] According to a seventh aspect of the present invention, there isprovided a device testing apparatus comprising a socket having aconnection terminal to which an electronic device under test isdetachably connected; a pusher for contacting a first surface of theelectronic device and pushing the electronic device in the direction ofthe connection terminal so as to connect the electronic device to theconnection terminals; a non-contact type temperature sensor arranged atthe pusher side for measuring a temperature of a first surface of theelectronic device; and a cooling medium blowing means for blowing acooling medium around the electronic device.

[0026] According to an eighth aspect of the present invention, there isprovided a device testing apparatus comprising a socket havingconnection terminals to which an electronic device under test isdetachably connected; a pusher for pushing the electronic device in thedirection of the connection terminals so as to connect the electronicdevice to the connection terminals; a non-contact type temperaturesensor arranged at the pusher side for measuring a temperature of thepusher; and a cooling medium blowing means for blowing a cooling mediumaround the electronic device.

[0027] In the device testing apparatuses according to the fourth toeighth aspects of the present invention, the pusher is not particularlylimited, but the effect of the present invention is larger when it has apickup nozzle attached under a suction head, the suction head isattached to a rotary arm, and the rotary arm is rotatably attached to ashaft.

[0028] In the device testing apparatuses according to the fourth toeighth aspects of the present invention, even when the electronic devicegenerates heat on its own at the time of testing, the temperature riseof the electronic device is detected by the temperature sensor and, whenthe electronic device rises in temperature more than necessary, acooling medium is blown on to the electronic device directly or to thepusher to thereby cool the electronic device. Accordingly, the effect ofthe heat generated by the electronic device is canceled and theelectronic device can be tested at a predetermined temperature asprescribed in the specifications. Note that the cooling medium ispreferably dry air cooled to a predetermined temperature. Dry air ispreferable to prevent condensation in low temperature tests.

[0029] Note that when testing the electronic device at ordinarytemperature, it is possible to eliminate the test chamber. When testingan electronic device at a low temperature, however, if just holding theelectronic device in a low temperature state, condensation sometimesbecomes a problem, so it is desirable to use a test chamber to cover thearea around the connection terminals to which the electronic device isdetachably connected. Further, when testing an electronic device at ahigh temperature, the present invention is effective from the viewpointof control of the temperature of the electronic device so that it doesnot exceed a predetermined temperature.

[0030] In particular, in a device testing apparatus according to thefourth aspect of the present invention, the temperature sensor fordetecting the temperature of the electronic device is arranged at thesocket side. In a device testing apparatus having a rotary arm typesuction head, the pusher attached to the suction head rotates, but thesocket side differs from the rotatable pusher side in that it is securedto the top of the test head. Therefore, in the device testing apparatusaccording to the fourth aspect of the present invention, the electricalwiring from the temperature sensor is extremely easy and it is possibleto avoid breakage of the cable from the temperature sensor and othersituations.

[0031] Further, in a device testing apparatus having a rotary arm typesuction head, a plurality of suction heads are generally arranged aboutthe shaft. When attaching temperature sensors to the pushers attached tothe suction heads, a number of temperature sensors equal to the numberof pushers becomes necessary. As opposed to this, in the device testingapparatus according to the present invention, it is sufficient toprovide a number of temperature sensors corresponding to the number ofsockets to which the electronic devices are attached. It is thereforepossible to reduce the number of temperature sensors.

[0032] In a device testing apparatus according to the fifth aspect ofthe present invention, a cooling medium is blown toward the back of theelectronic device from the socket side to cancel out the temperaturerise due to the heat generated by the electronic device and test theelectronic device at the temperature as prescribed in the specification.In the related art, the general practice has been to blow a coolingmedium from the top side (pusher side) of the electronic device to thearea around the electronic device, but the electronic device cannot besaid to have been sufficiently cooled. In the device testing apparatusaccording to the fifth aspect of the present invention, by directlyblowing a cooling medium toward the back of the electronic device, it ispossible to improve the cooling efficiency of the electronic device,cancel out the effect of the heat generated by the electronic devicewell, and test the electronic device at a predetermined temperature asprescribed in the specifications.

[0033] In the device testing apparatus according to a sixth aspect ofthe present invention, the cooling medium is blown to the side surfaceof the pusher. A variety of components are arranged around the socketused in the testing of the electronic device and it is often difficultto blow a cooling medium directly toward the electronic device. In thedevice testing apparatus according to the sixth aspect of the presentinvention, the cooling medium is blown toward the side surface of thepusher to cool the electronic device indirectly. At this time, byproviding heat exchange fins or other projections or depressions at theouter circumference of the pusher, it is possible to increase the heatexchange efficiency, cool the pusher efficiently, and efficiently coolthe electronic device indirectly. In the device testing apparatusaccording to the sixth aspect of the present invention as well, it ispossible to cancel out the effect of the heat generated by theelectronic device well and test the electronic device at a predeterminedtemperature as prescribed in the specifications.

[0034] In the device testing apparatus according to a seventh aspect ofthe present invention, the temperature of the pusher side surface of theelectronic device is measured by a non-contact type temperature sensor.When the terminals of the electronic device are arranged over the entireback (second surface) of the electronic device, connection terminals arearranged without space between them at the socket as well. In such acase, it is difficult to measure the temperature of the electronicdevice from the socket side. In the device testing apparatus accordingto the seventh aspect of the present invention, the temperature of thepusher side surface of the electronic device is measured by anon-contact type temperature sensor.

[0035] If the non-contact type temperature sensor is used, there is noneed to secure the pusher and there is no need to rotate it togetherwith the pusher. Therefore, even if a device testing apparatus having arotary arm type suction head, the electrical wiring from the temperaturesensor does not become complicated. In the device testing apparatusaccording to the seventh aspect of the present invention, a non-contacttype temperature sensor is used to accurately measure the temperature ofthe electronic device and a cooling medium is blown on the electronicdevice based on the measurement results to cool the electronic device.Therefore, it is possible to cancel out the effect of heat generated bythe electronic device well and test the electronic device at apredetermined temperature as prescribed in the specifications.

[0036] In the device testing apparatus according to an eighth aspect ofthe present invention, the temperature of the pusher pushing theelectronic device in the socket direction is measured by a non-contacttype temperature sensor. A variety of components are arranged around thesocket used in the testing of the electronic device and it is oftendifficult to directly measure the temperature from the pusher sidesurface (first surface) of the electronic device. In the device testingapparatus according to the eighth aspect of the present invention, thetemperature of the electronic device is not measured directly. Thetemperature of the pusher is measured to estimate the temperature of theelectronic device and detect the temperature rise due to the heatgenerated by the electronic device. Since the electronic device is incontact with the pusher, if the electronic device rises in temperaturedue to the heat it generates on its own, the pusher also rises intemperature. The temperature of the pusher and the temperature of theelectronic device, however, do not always match, so in order to estimatethe temperature of the electronic device from the detected temperatureof the pusher, it is necessary to consider a correction value found byexperiments etc. for the detected temperature of the pusher to estimatethe temperature of the electronic device.

[0037] Further, in the device testing apparatus according to the eighthaspect of the present invention as well, since a non-contact typetemperature sensor is used, there is no need to secure the temperaturesensor to the pusher and no need to make it rotate along with thepusher. Therefore, even with a device testing apparatus having a rotaryarm type suction head, the electrical wiring from the temperature sensordoes not become complicated. Further, in the device testing apparatusaccording to the eighth aspect of the present invention, a non-contacttype temperature sensor is used to measure the temperature of thepusher, the temperature of the electronic device is accurately predictedfrom the detected temperature, and, based on the results, a coolingmedium is blown on the electronic device to cool the electronic device.Therefore, it is possible to cancel out the effect of heat generated bythe electronic device well and test the electronic device at apredetermined temperature as prescribed in the specifications.

[0038] According to a ninth aspect of the present invention, there isprovided a device testing apparatus comprising a pusher for holding orpushing an electronic device to make it approach or move away from acontact portion of a test head; a temperature sensor provided at thepusher; a first terminal of the temperature sensor provided at thepusher; and a second terminal provided at the contact portion side andcontacting or not contacting the first terminal of the temperaturesensor along with the movement of the pusher.

[0039] According to a 10th aspect of the present invention, there isprovided a device testing apparatus comprising a pusher for holding orpushing an electronic device to make it approach or move away from acontact portion of a test head; a temperature sensor provided at thepusher; a first terminal of the temperature sensor provided at thepusher; a second terminal provided at the contact portion side andcontacting or not contacting the first terminal of the temperaturesensor along with the movement of the pusher; and an air blower unit forblowing cooling air to the electronic device in a state where theelectronic device held by the pusher is pushed against the contactportion.

[0040] Preferably, at least one of the first terminal and secondterminal is provided to be able to move in the direction of movement ofthe pusher.

[0041] Preferably the air blower unit is arranged around the contactportion.

[0042] Preferably the air blower unit has a cooling air passage throughwhich cooling air is blown substantially horizontally to an electronicdevice pushed against the contact portion.

[0043] In the device testing apparatuses according to the ninth and 10thaspects of the present invention, the first terminal and second terminalcontact each other at least when detection of the temperature by atemperature sensor is necessary. There is no need for connection by acable etc. at other times and there is no longer a chance of the cableof the temperature sensor breaking along with movement of the pusher.

[0044] In particular, in the device testing apparatus according to the10th aspect of the present invention, since an air blower unit isprovided around the contact portion and cooling air is blownsubstantially horizontally to the electronic device, a sufficient amountof cooling air can be provided and, further, the electronic device as awhole is blown against evenly, so the cooling effect on the electronicdevice is increased and the effect of suppression of the rise oftemperature due to the heat generated by the electronic device becomesmore remarkable. Further, due to the increase of the effect ofsuppression of the temperature rise, it is possible to cool with a smallamount of fluid or by blowing fluid for a short amount of time.

[0045] According to an 11th aspect of the present invention, there isprovided a device testing apparatus comprising a tray for testing whilepushing terminals of a plurality of electronic devices carried on thetray against contact portions of a test head; a pusher for pushing eachof the plurality of electronic devices held on the tray in the directionof the contact portions; and a heat absorbing and radiating memberprovided at the pusher.

[0046] The heat absorbing and radiating member may be provided separatefrom at least part of the pusher.

[0047] Preferably, the pusher comprises a pusher base provided to beable to move to approach or move away from the contact portion and apusher block provided integrally with or separate from the pusher base,contacting the electronic device from the reverse surface of the contactportion, and pushing the same.

[0048] Preferably, the pusher block is configured as separate from thepusher base and further comprises an elastic member for impartingelasticity to the pusher block in the direction of pushing theelectronic device.

[0049] Preferably a heat absorbing and radiating member is providedbetween elastic members. More preferably, heat absorbing and radiatingmembers are provided at the two sides of an elastic member.

[0050] More preferably, a flow of gas in the chamber for maintaining anelectronic device at a predetermined temperature is blown against theheat absorbing and radiating member. Still more preferably, the pusheris formed with a passage for guiding the flow of gas in the chamber formaintaining the electronic device at a predetermined temperature in thedirection of the heat absorbing and radiating member.

[0051] Further, the pusher may be formed with a nozzle for guidingtemperature control gas, separate from the gas flow in the chamber formaintaining the electronic device at a predetermined temperature, in thedirection of the heat absorbing and radiating member.

[0052] In the device testing apparatus according to the 11th aspect ofthe present invention, since a heat absorbing and radiating member (typeof cooling unit) is provided at the pusher block (part of pusher), theheat generated by the electronic device is absorbed by the heatabsorbing and radiating member and escapes to the surroundingenvironment from there. As a result, it is possible to preventdestruction or damage of the electronic devices due to overheating,considered a particular problem in high temperature tests etc.

[0053] Further, not limited to high temperature tests, the rise intemperature due to the heat generated by the devices is suppressed bythe heat absorbing and radiating effect of the heat absorbing andradiating member, so it is possible to conduct tests by the desiredaccurate temperature and the reliability of the test results isimproved.

[0054] The heat absorbing and radiating member is not particularlylimited, but is configured by a metal etc. superior in heatconductivity. A heat sink formed by heat-radiating fins etc. ispreferably used.

[0055] In the device testing apparatus according to the 11th aspect ofthe present invention, the mode of transport of the electronic device tothe contact portions is of the type of pushing the electronic device tothe contact portion in the state carried on a tray. In particular, inthis type, a large number of electronic devices are simultaneouslypushed for simultaneous measurement of a large number of electronicdevices. Therefore, the area around each electronic device becomesoverly crowded and heat easily accumulates. Accordingly, the 11th aspectof the present invention is more preferably applied to a device testingapparatus of a type pushing electronic devices against contact portionsin the state carried on a tray.

[0056] In the device testing apparatus according to the 11th aspect ofthe present invention, when pushing the terminals of an electronicdevice against the contact portion of the test head, the pusher base ismade to approach the contact portion and the electronic device is pushedto the contact portion side by the pusher block.

[0057] At this time, the positional relationship of the pusher base andthe contact portion is restricted to standard dimensions by a stopper orother mechanical mechanism or electrical motor or other electricalmechanism. When error occurs in the positional relationship between thepusher base and the contact portion, the error is absorbed by the pusherblock imparting elasticity to the electronic device by an elasticmember. Therefore, it is possible to prevent an excessive pushing forcefrom acting on the electronic device and conversely the pushing forcebecoming insufficient. That is, in the device testing apparatusaccording to the 11th aspect of the present invention, the stroke of thepusher is not managed. The pushing force against the electronic deviceis made uniform by controlling the load by the pusher block.

[0058] The elastic member is not particularly limited. A coil spring orother various types of elastic members or actuators etc. may be used.Further, the elastic member may be provided at other locations inaddition to the pusher base.

[0059] The main error occurring in the positional relationship betweenthe pusher base and the contact portion may be considered to be thethickness ΔX of the electronic device itself, the manufacturingdimensions ΔY between the pusher side stopper and pusher surface, andthe manufacturing dimensions ΔZ between the contact portion side stopperand tips of the contact pins. The cumulative amount of the ΔX to ΔZnormally rises to as much as ±0.1 to ±0.2 mm or so. When considering thecase of use of for example coil springs as the elastic members, however,the error of the pushing force acting on the electronic device becomes±3 gf/ball or so with respect to a standard load of 25 gf/ball even whenerror of ±2 mm occurs. There is therefore no problem of an excessiveload or insufficient load.

[0060] The elastic member is not particularly limited, but morepreferably it is made variable in elasticity.

[0061] Variability of the elasticity means the elasticity in thedirection of pushing the electronic devices given to the pusher blockcan be changed. The specific means is not particularly limited. Forexample, it is possible to make the elasticity variable by switchingamong a plurality of types of elastic members having differentcoefficients of elasticity or possible to make the elasticity variableby using the same elastic members and changing the basic length of theelastic members.

[0062] By making the elasticity of the elastic members variable, it ispossible to flexibly deal with any fluctuations in the standard load(pushing force) caused by the test conditions of the electronic devices.Therefore, the range of application of the device testing apparatusbecomes greater.

[0063] According to the 11th aspect of the present invention, theapparatus can be made smaller in size by efficiently arranging theelastic members and the heat absorbing and radiating member between thepusher based and the pusher block.

[0064] Further, according to the 11th aspect of the present invention,by blowing a gas flow in the chamber to a plurality of electronicdevices, the gas flow is supplied evenly on the electronic devices, thevariation in the temperature distribution due to the heat generated bythe electronic devices etc. can be effectively suppressed, and the timefor elevation or reduction of the temperature can be shortened.

[0065] Further, by forming a passage for guiding the gas flow in thedirection of the heat absorbing and radiating member in the pusherbase/or pusher block, the gas flow is evenly supplied to the electronicdevices, variation in the temperature distribution due to the heatgenerated by the electronic devices can be effectively suppressed, andthe time for elevation or reduction of the temperature can be shortened.

[0066] Further, by providing the pusher base and/or pusher block with anozzle for guiding a temperature control gas, separate from the gas flowin the chamber for maintaining the electronic devices at a predeterminedtemperature, toward the direction of the heat absorbing and radiatingmember, fluctuations in the temperature distribution due to the heatgenerated by the electronic device can be effectively suppressed and thetime for elevation or reduction of the temperature can be shortened.

[0067] The type of the device testing apparatuses according to the firstto 11th aspects of the invention is not particularly limited. Theinvention may be applied to ones which hold, pick up, or simply pushelectronic devices, device testing apparatuses of a type holding andtesting a plurality of electronic devices, device testing apparatuses ofa type testing a plurality of electronic devices loaded on a test tray,etc.

BRIEF DESCRIPTION OF THE DRAWINGS

[0068] These and other objects and features of the present inventionwill become more apparent from the following description of thepreferred embodiments given with reference to the attached drawings, inwhich:

[0069]FIG. 1 is a schematic overall view of an IC chip testing apparatusaccording to a first embodiment of the present invention;

[0070]FIG. 2 is a sectional view of key portions of the IC chip testingapparatus;

[0071]FIG. 3 is a sectional view of key portions showing the vicinity ofconnection terminals of an IC chip testing apparatus;

[0072]FIG. 4 is a sectional view of key portions showing the vicinity ofconnection terminals of an IC chip testing apparatus according toanother embodiment of the present invention;

[0073]FIG. 5 to FIG. 12 are sectional views of key portions of IC chiptesting apparatuses according to other embodiments of the presentinvention;

[0074]FIG. 13 is a schematic perspective view of an IC chip testingapparatus according to still another embodiment of the presentinvention;

[0075]FIG. 14 is a schematic view of a method of handling an IC chip ina device testing apparatus shown in FIG. 13;

[0076]FIG. 15 is a disassembled perspective view of a test tray providedin the device testing apparatus shown in FIG. 13;

[0077]FIG. 16 is a disassembled perspective view of the structure of abush, insert (test tray), socket guide, and contact pins (contactportion) in the test head shown in FIG. 13;

[0078]FIG. 17 is a sectional view of key portions along the lineXVII-XVII shown in FIG. 16;

[0079]FIG. 18 is a sectional view of key portions along the lineXVIII-XVIII shown in FIG. 16;

[0080]FIG. 19 is a disassembled perspective view of an example of amatch plate;

[0081]FIG. 20 is a sectional view of the structure of the inside of atest chamber;

[0082]FIG. 21 is a disassembled perspective view of another embodimentof the present invention (corresponding to FIG. 16);

[0083]FIG. 22 is a disassembled perspective view of an example of amatch plate of the embodiment shown in FIG. 21;

[0084]FIG. 23 is a sectional view of the structure of the inside of atest chamber of the embodiment shown in FIG. 21;

[0085]FIG. 24 is a disassembled perspective view of still anotherembodiment of the present invention;

[0086]FIG. 25 is a sectional view along the line XXV-XXV of a test headportion of the embodiment shown in FIG. 24;

[0087]FIG. 26 is a sectional view of the inside of a chamber of a devicetesting apparatus according to another embodiment of the presentinvention;

[0088]FIG. 27 is a plane view of key portions of the match plate shownin FIG. 26; and

[0089]FIG. 28 is a sectional view of key portions of the device testingapparatus according to another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0090] First Embodiment

[0091] As shown in FIG. 1, the IC chip testing apparatus 2 according tothe present embodiment is an apparatus for testing an IC chip, as adevice under test, in an ordinary temperature, low temperature, or hightemperature state and is provided with a handler 4 and a main test unit,not shown. The handler 4 conveys IC chips under test successively to ICsockets provided at the test head and stores the IC chips finished beingtested on predetermined trays sorted in accordance with the testresults.

[0092] In this embodiment, the handler 4 is provided with a chamber 6.The top of a test head 10 is exposed at a test stage 8 in the chamber 6.The top of the test head 10 is shown in FIG. 2. The top of the test head10 has a socket 20 attached to it. The chip mounting opening of thesocket 20 faces the inside of the chamber so that the IC chips 22 undertest conveyed from a suction head 24 may be successively detachablymounted in it.

[0093] The IC sockets 20 provided on the test head 10 are connectedthrough cables to the main test unit (not shown). IC chips 22 detachablymounted at the IC sockets 20 are connected through the cables to themain test unit, then the IC chips 22 are tested by test signals from themain test unit. Details of the IC sockets 20 will be given later.

[0094] As shown in FIG. 1, the handler 4 has an IC magazine 30 forstoring IC chips to be test and storing tested IC chips sorted intoclasses. The IC magazine 30 holds loader use trays 32A on which IC chipsto be tested are carried, sorting trays 32B to 32E on which tested ICchips are carried sorted into classes, empty trays 32F, and option trays32G. These trays 32A to 32G are arranged at predetermined intervalsalong the X-direction and are stacked in the Z-direction (heightdirection).

[0095] IC chips carried on a loader tray 32A are conveyed to a soakstage 36 inside the chamber 6 using the first XY-conveyor 34 attached tothe handler 4. Further, the IC chips finished being tested at the testhead 10 are loaded and sorted on the sorting trays 32B to 32E of the ICmagazine 30 using the second XY-conveyor 35. Among the sorting trays 32Bto 32E, for example, the trays 32C are the tray for good devices, whilethe other trays are the trays for the defective devices or devices forretesting.

[0096] The empty trays 32F are conveyed to and stacked over the sortingtrays 32B to 32E which have become filled with the tested IC chips andare used as sorting trays. The option trays 32G are used for otherapplications.

[0097] The inside of the chamber 6 is air-tight in structure except forthe portion for transfer of the IC chips which is designed to be able toopen and close by a shutter etc. and for example can maintain a hightemperature state of room temperature to about 160° C. or a lowtemperature state of room temperature to about −60° C. The inside of thechamber 6 is divided into a soak stage 36, a test stage 8, and an exitstage 40.

[0098] The soak stage 36 has a turntable 38 arranged in it. The surfaceof the turntable 38 has indentations 42 for temporarily holding IC chipsarranged at a predetermined pitch along the circumferential direction.In the present embodiment, there are two rows of indentations 42 formedin the radial direction of the turntable 38. The two rows ofindentations 42 are arranged at a predetermined pitch in thecircumferencial direction. The turntable 38 turns clockwise. The ICchips carried into the indentations 42 of the turntable 38 at theloading position 44 by the first XY-conveyor 34 are given a thermalstress (low temperature or high temperature) until the temperatureconditions to be tested are reached while the turntable 38 is beingindexed in the direction of rotation.

[0099] At a takeout position 46 about 240 degrees in the direction ofrotation from the loading position 44 based on the center of rotation ofthe turntable 38, the suction heads attached to one of the three contactarms 48 are positioned above the turntable 38. At that position, ICchips can be taken out from the indentations 42 by the suction heads.The three contact arms 48 are attached at angles of substantially equalamounts in the circumferential direction with respect to the shaft 50and can be indexed 120 degrees at a time in the clockwise direction ofrotation about the shaft 50. Note that this “index” means to repeatedlyturn by a predetermined angle, then stop, then again turn by apredetermined angle. At the time of this indexing of a contact arm 48,the time when the arm 48 is stopped corresponds to the time during whichIC chips are mounted in sockets of the test head 10 and tested plus thetime for detachment of the IC chips from the sockets. The stopping timeof this indexing is the same as the stopping time of the indexing at theturntable 38. The turntable 38 and the contact arms 48 are rotated to beindexed synchronously.

[0100] In the embodiment, the suction heads of one of the three contactarms 48 are positioned above the takeout position 46 of the soak stage36, the suction heads of another of the contact arms 48 are positionedabove the contact heads 10 of the test stage 8, and the suction heads ofthe other of the contact arms 48 are positioned above the inlet 52 ofthe exit stage 40.

[0101] The IC chips loaded in the indentations 42 of the turntable 38 atthe loading position 44 of the turntable 38 are given a predeterminedthermal stress while being indexed from the loading position 44 to thetakeout position 46 and are picked up by the suction heads of a contactarm 48 at the takeout position 46. The IC chips picked up by the suctionheads are positioned above the test head 10 by the indexing of thecontact arm 48 in the clockwise direction. At that position, as shown inFIG. 2, the IC chips 22 picked up and held by the suction heads 24 areattached to the sockets 20 and tested.

[0102] The IC chips 22 attached to the sockets 20 above the test head 10and finished being tested are picked up again by the suction heads 24and positioned above the inlet 52 of the exit stage 40 by the indexingof the contact arm 48 shown in FIG. 1 in the clockwise direction. Atthis position, the tested IC chips are slid to the exit position 54 byan exit shifter in the direction of the arrow A. At the exit position ofthe exit stage 40, the IC chips arranged above the exit shifter arereturned from the temperature of the test, that is, the low temperatureor the high temperature, to ordinary temperature. In the case of a lowtemperature test, the IC chips are returned to ordinary temperature atthe exit stage 40 so it is possible to effectively prevent condensationfrom occurring on the IC chips directly after being taken out from thechamber 6.

[0103] The IC chips arranged above the exit shifter at the exit position54 of the exit stage 40 are returned to ordinary temperature, thenshifted in the direction of the arrow B by a not shown exit arm andmoved to an exit turn arranged at the receiving position 56. The exitturn is designed to be able to move back and forth between the receivingposition 56 and the eject position 58 by turning in the direction of thearrow C. The suction heads of the second XY-conveyor 35 are designed tobe able to move to the eject position 58 of the exit turn. The tested ICchips arranged at the eject position by the exit turn are conveyed bythe conveyor 35 to one of the sorting trays 32B to 32E based on the testresults.

[0104] In the device testing apparatus 2 according to the presentembodiment, a soak stage heat exchanger 60 is arranged at the ceiling ofthe soak stage 36 inside the chamber 6 of the handler 4 and a test stageheat exchanger 62 is arranged at the side wall of the test stage 8.These heat exchangers 60 and 62 are provided with cooling units usingliquid nitrogen etc. as a coolant and blowers for circulating thecooling air inside the chamber when the tester 2 is able to perform lowtemperature tests. When the tester is able to perform high temperaturetests, the heat exchangers 60 and 62 are provided with heating units andblowers. When the tester is able to perform low temperature tests andhigh temperature tests, the heat exchangers 60 and 62 are provided withcooling units, heating units, and blowers and are used switching betweenthe cooling units and heating units. These heat exchangers 60 and 62 arecontrolled by a temperature controller 70. The temperature controller 70receives as input output signals from a temperature sensor 72 arrangedat the test stage 8, temperature sensor 74 arranged at the soak stage36, and other sensors and can control the amount of heat exchange(output) of the heat exchangers 60 and 62 in accordance with the outputsignals from these sensors.

[0105] In the following explanation, the explanation will be given ofthe case where the tester 2 is one able to perform both high temperaturetests and low temperature tests and the apparatus is used mostly forperforming low temperature tests.

[0106] As shown in FIG. 2, at the test stage 8, the bottom of thechamber 6 comprised of a heat insulating material etc. and part of themain base 80 holding the chamber 6 are cut away. A socket 20 held on atest head 10 is attached there.

[0107] The socket 20 is held in a socket guide 82. The socket guide 82is attached to a base ring 88. The base ring 88 is attached to amounting base 90 and constitutes the chamber opening 92. The mountingbase 90 has a heat insulating property similar to that of the chamber 6and is detachably secured to the bottom opening of the chamber 6 and themain base 80.

[0108] The back surface of the socket 20 (outside of chamber) has a lowtemperature socket adapter 98 connected to it. The terminals of thesocket 20 are electrically connected with. The adapter 98 is secured atthe surface of the approximate center portion of the printed circuitboard 100 and enables the electrical connection between the terminals ofthe socket 20 and the printed circuit board 100. The test head 10 isattached to the bottom surface of the printed circuit board 100. Notethat the printed circuit board 100 is also called a performance board.

[0109] The test head 10 receives a drive signal from the main test unit,not shown, and sends a test drive signal to an IC chip 22 attached tothe socket 20 through the printed circuit board 100 and the adapter 98.

[0110] In the present embodiment, as shown in FIG. 2, a heating board106 having an opening at its center is bolted etc. to the back surfaceof the mounting base 90 (outside of chamber) through a mounting boardserving as both a heat insulating material and seal member. The heatingboard 106 is also called an HIFIX heater and comprised of a rubberheater or other planar heating element 108 sandwiched between aluminumsheets etc. At the bottom surface of the heating board 106 is affixed inadvance a first seal member 112. The first seal member 112 is configuredfor example as a silicone sponge rubber sheet or other sheet havingelasticity.

[0111] In this embodiment, when securing the socket adapter 98 attachedto the approximate center of the printed circuit board 100 serving asthe test board by connecting it to the socket 20, the outercircumferential surface of the printed circuit board 100 directlycontacts the bottom surface of the heating board 106 through the firstseal member 112 and the printed circuit board 100 a is directly heatedby the heating board 106.

[0112] The heating board 106 has radial drying passages 110 formed init. Dry gas can be sealed in the first air-tight space 118 formedbetween the socket guide 82 and the printed circuit board 100. As thedry gas for sealing inside the first air-tight space 118, for exampleuse is made of dry air having for a condensation temperature lower thanthe inside temperature of the chamber 6. For example, when the inside ofthe chamber 6 is about −55° C., the condensation temperature of the dryair sealed inside the first air-tight space 118 a through the dryingpassages 110 is preferably about −60° C. The temperature of the dry airis for example room temperature.

[0113] As shown in FIG. 3, in the present embodiment, the socket 20 hasattached to it connection terminals 21 able to deform elastically in thevertical direction. The bottom ends of the connection terminals 21 areconnected to the printed circuit board 100. The top ends of theconnection terminals 21 are formed with contacts 21 a against which theterminals 22 a of the IC chip 22 are pushed and electrically connected.

[0114] In the present embodiment, the suction head 24 also functions asa pusher. When testing an IC chip 22, the IC chip 22 picked up by thevacuum suction bore 25 is pushed in the direction of the connectionterminals 21 to secure electrical connection between the terminals 22 aand the contacts 21 a of the connection terminals 21.

[0115] The bottom end of the suction head 24 has attached to it apushing pad 26 for contacting the top surface of the terminals 22 a ofthe IC chip 22 and pushing these terminals 22 a against the contacts 21a of the connection terminals 21. The pushing pad 26 is comprised of asynthetic resin or other insulating member.

[0116] Inside of the suction head 24 positioned around the bottom end ofthe vacuum suction bore 25 is buried a cooling unit 27 directlycontacting the IC chip 27 or indirectly contacting it through aninsulating member for cooling the same. The cooling unit 27 is comprisedfor example of a Peltier element, vortex tube, heat pipe, cooling useheat exchanger, etc. A Peltier element is an element able to cool byelectricity. A vortex tube is a cooling unit able to cool by blowingcompressed air. A heat pipe is a unit using the movement of fluid in thepipe to absorb heat. As the heat exchanger, a passage for circulatingliquid nitrogen or another coolant or a passage for circulating acoolant from a refrigeration cycle may be mentioned. Note that whenusing as a cooling unit 27 a Peltier element or heat pipe, the positionopposite to the cooling side becomes a heat radiating portion, so, asshown in FIG. 3, the cooling fins 29 may be connected to the coolingunit 27. Further, when the suction head 24 itself is superior in heatconductivity, the outer circumferential surface of the suction head isprocessed to roughen it to make it function as heat radiating fins.Further, the cooling unit 27 may be another cooling unit than the above.

[0117] Near the cooling unit 27 is arranged a temperature sensor 28. Thetemperature of the IC chip 22 cooled by the cooling unit 27 can bedirectly or indirectly measured. The temperature sensor 28 is notparticularly limited, but a platinum sensor or other thermocouple orother temperature sensor can be used. The temperature signal measured bythe temperature sensor 28 is input to the controller. This controls thecooling output by the cooling device 27 so as to cancel the heatgenerated by the IC chip 22 during tests and maintain the IC chip 22constantly at a predetermined temperature.

[0118] In the IC chip testing apparatus 2 according to the presentembodiment, even if the IC chip 22 generates heat on its own at the timeof testing, the cooling unit 27 cools the IC chip 22, so it is possibleto cancel out the effect due to the heat generated by the IC chip 22 andto test the IC chip 22 at a predetermined low temperature as prescribedin the specifications.

[0119] In the device testing apparatus of the present embodiment, aheating board 106 is attached around the chamber opening 92 a of thechamber 6 with an inside cooled to a temperature below ordinarytemperature and the printed circuit board 100 a is heated by heatconduction. The printed circuit board 100 positioned behind the socket20 is heated to a temperature above the condensation point of theambient gas. Therefore, it is possible to effectively preventcondensation from occurring at the printed circuit board 100 behind thesocket.

[0120] Further, in the IC chip testing apparatus according to thepresent embodiment, since a special spacing frame or other heatinsulating structure is not employed, the manufacturing costs becomelower. Further, since the distance between the printed circuit board 100and the socket 20 is remarkably short, the electrical path from thesocket 20 to the printed circuit board 100 (electrical cables etc.) canbe shortened, greater resistance to noise can be obtained, and thereliability of the tests can be improved.

[0121] Further, in the IC chip testing apparatus 2 according to thisembodiment, by bringing the printed circuit board 100 into contact withthe heating board 106 so as to form a first air-tight space 118 at theprinted circuit board side of the socket guide 82 and forming in theheating board 106 a drying passage 110 for feeding dry gas in the firstair-tight space 118, the first air-tight space 118 can be filled with adry gas. This enables condensation behind the socket guide 82 to befurther effectively prevented.

[0122] Second Embodiment

[0123] As shown in FIG. 4, in the second embodiment of the presentinvention, no cooling unit is attached at the suction head 24 a side. Acooling unit 27 a or 27 b is attached at the side of the socket 20. Theposition of arrangement of the cooling unit 27 a or 27 b is notparticularly limited, but for example as shown in FIG. 4 the unit may bearranged between the socket 20 and socket adapter 98 or at the positionof the bottom ends of the connection terminals 21.

[0124] When arranging the cooling unit 27 a between the socket 20 andthe socket adapter 28, it is preferable to form a space to preventshort-circuiting with the connection terminals 21. In this case, thecooling unit 27 a cools the IC chip 22 through the socket 20 to cancelthe heat generated by the IC chip 22 and thereby enable the IC chip 22to be tested at a low temperature as prescribed in the specifications.

[0125] When arranging the cooling unit 27 b at the position of thebottom ends of the connection terminals 21, the cooling unit 27 b isattached at the bottom ends of the connection terminals 21 through aplastic or other insulating member 29. In this case, the cooling unit 27b cools the IC chip 22 through the insulating member 29 and connectionterminals 21 to cancel the heat generated by the IC chip 22 and therebyenable the IC chip 22 to be tested at a low temperature as prescribed inthe specifications.

[0126] The cooling units 27 a and 27 b are comprised of cooling unitssimilar to the above cooling unit 27. Note that when the cooling unit 27a or 27 b itself has an insulating property, the cooling unit 27 a or 27b may be brought into direct contact with the connection terminals 21.The cooling unit 27 a or 27 b may be provided with heat radiating fins29 a or 29 b if necessary for cooling.

[0127] Modifications of First Embodiment and Second Embodiment

[0128] In the above first and second embodiments, the explanation wasmade with reference to an IC chip testing apparatus 2 mainly performinglow temperature tests, but it is also possible to use the device 2 ofthe present embodiments to conduct ordinary temperature tests ofelectronic devices. In this case, the test chamber 6 and the temperaturecontroller attached inside it may be eliminated. Even without the testchamber 6 and the internal temperature controller, if it were possibleto control the IC chip 22 to a predetermined ordinary temperature byjust the cooling unit 27, 27 a, and/or 27 b, the chamber 6 and internaltemperature controller would become unnecessary.

[0129] When conducting low temperature tests on an IC chip 22, however,if just maintaining the IC chip 22 at a low temperature state,condensation would sometimes become a problem, so it is preferable touse the test chamber 6 to cover the test stage 8 and maintain theambient temperature of the inside of the chamber 6 at a predeterminedlow temperature state.

[0130] Further, even when conducting high temperature tests on an ICchip 22, the present invention is effective from the viewpoint ofcontrol to prevent the temperature of the IC chip 22 exceeding apredetermined temperature.

[0131] Third Embodiment

[0132] The overall configuration of the IC chip testing apparatusaccording to the present invention is similar to that of the devicetesting apparatus according to the first embodiment shown in FIG. 1.Part of the explanation thereof will therefore be omitted.

[0133] As shown in FIG. 5, at the test stage, part of the chambercomprised of the heat insulating material etc. is cut away. A socket 120held on a test head is attached there.

[0134] The socket 120 is held by the socket guide 180. The socket guide180 is attached to the bottom opening of the chamber 6 shown in FIG. 1through a not shown base ring etc.

[0135] A printed circuit board 184 is arranged behind the socket 120(outside of chamber). The socket 120 has attached to it connectionterminals 121 able to elastically deform in the vertical direction. Thebottom ends of the connection terminals 121 are connected to the printedcircuit board 184. The top ends of the connection terminals 121 arepushed against by the terminals of the IC chip 122 for electricalconnection. At the bottom surface of the printed circuit board 184 isattached a test head 110. Note that the printed circuit board 184 isalso called a performance board.

[0136] The test head 110 receives a drive signal from the main testunit, not shown, and sends a test drive signal to the IC chip 122connected to the connection terminals 121 of the socket 120 through theprinted circuit board 184.

[0137] In the present embodiment, as shown in FIG. 5, a suction nozzle127 having a vacuum suction bore 125 is provided below each of thesuction heads 124. The suction nozzle 127 also serves as a pusher. Whentesting the IC chip 122, the IC chip 122 picked up by the vacuum suctionbore 125 is pushed in the direction of the connection terminals 121 tosecure electrical connection between the terminals of the IC chip 122and the connection terminals 121.

[0138] At the bottom end of the suction nozzle 127 is attached a pushingpad 126 for contacting the top surface of the IC chip 122 (firstsurface) and pushing the terminals of the IC chip 122 against theconnection terminals 121 of the socket 120. The pushing pad 126 iscomprised of a synthetic resin or other insulating material. Note thatan outer cylinder 128 may be provided around the outer circumference ofthe suction nozzle 127. The outer cylinder 128 is for example comprisedof a conductive metal. By its lower end contacting the IC chip 122, itis possible to drain the static electricity of the chip 122. In thepresent invention, the pusher also includes this outer cylinder 128.

[0139] The vacuum suction bore 125 formed in the suction nozzle 127 isgiven a suitable negative pressure by a not shown ejector or othervacuum generator to detachably pick up and hold the IC chip 122 at thelower end of the suction pad 126. Note that at the time of testing theIC chip 122, negative pressure is not introduced to the vacuum suctionbore 125. An IC chip 122 is pushed by the suction pad 126 in thedirection of the socket 120 for connection of the terminals of the ICchip 122 and the connection terminals of the socket 120.

[0140] As shown in FIG. 5, in the present embodiment, a temperaturesensor protecting cylinder 186 is attached through the approximatecenter of the socket 120 and the printed circuit board 184. Inside thetemperature sensor protecting cylinder 186 is formed an axial bore 188along the axial direction. Behind the wall at the top part of the axialbore 188 is attached a temperature sensor 190. In the presentembodiment, the temperature sensor 190 is comprised by a thermocouple,platinum temperature measuring resistor, thermistor, or othercontact-type temperature sensor. The temperature sensor 190 enablesdirect measurement of the temperature of the IC chip 122 by the topsurface of the wall of the top part of the sensor protecting cylinder186 being brought in close contact with the back (second surface) of theIC chip 122.

[0141] The temperature data of the IC chip 122 detected by thetemperature sensor 190 is sent to a not shown controller. The controllerdetects when the IC chip 122 has become higher than the set temperaturedue to heat it generates during testing and blows a cooling mediumthrough the cooling medium passage 182 (cooling medium blowing means)formed at the socket guide 180 or another member to around the IC chip122 to cool the IC chip 122.

[0142] The cooling medium is not particularly limited, but dry airhaving a condensation point about the same or lower than the insidetemperature of the chamber 6 is preferable. For example, when the insideof the chamber 6 is about −55° C., the condensation temperature of thedry air passing through the cooling medium passage 182 and blown aroundthe IC chip 122 is preferably a temperature of −55° C. or lower. Thetemperature of the cooling medium itself blown through the coolingmedium passage 182 toward the IC chip 122 is controlled to about thesame degree as the air temperature inside the chamber 6. The temperatureof the cooling medium, amount blown, and blowing time are determined sothat the temperature of the IC chip 122 detected by the temperaturesensor 190 becomes a temperature inside the permissible range of thetest specifications. That is, the controller monitors the temperatureoutput of the temperature sensor 190 and controls the temperature,amount, and blowing time of the cooling medium blown from the coolingmedium passage 182 to around the IC chip 122 so as to cancel out theheat generated by the IC chip 122 during testing and thereby control thetemperature so that the IC chip 122 is constantly maintained at a settemperature.

[0143] Note that the cooling medium passage 182 is comprised by forminga through hole in an existing socket adapter 180, but it is alsopossible to form a cooling medium passage in another member separatefrom the socket adapter 180. It is also possible to attach a tube,nozzle, etc. to blow the cooling medium around the IC chip 122. Further,the cooling medium passage 182 may be a single passage. When a pluralityare provided, however, the cooling efficiency is further improved.Further, it is possible to provide around the IC chip 122, along with acooling medium blowing means comprised of such a cooling medium passage182 etc., an ambient gas suction means for sucking in the gas around theIC chip 122. By sucking in the gas present around the IC chip 122 (gasbecoming higher in temperature than the set temperature due to the heatgenerated by the IC chip 122) and cooling the area around the IC chip122 by the cooling medium blowing means, the cooling efficiency isfurther improved.

[0144] In such an IC chip testing apparatus according to the presentembodiment, even if the IC chip 122 generates heat on its own at thetime of testing, the heat generated is detected by the temperaturesensor 190 and a cooling medium controlled in its temperature, amount,etc. so as to cancel out the effects of the heat generated by the ICchip 122 is blown from the cooling medium passage 182 toward the IC chip122 for a predetermined time. Therefore, at the time of testing, it ispossible to test an IC chip 122 at a predetermined set temperature asprescribed in the specifications at all times.

[0145] In particular, with an IC chip testing apparatus according to thepresent embodiment, since a temperature sensor 190 detecting thetemperature of the IC chip 122 is arranged at the socket 120 side, theelectrical wiring from the temperature sensor 120 becomes simple even ina tester having a rotary arm type suction head. Note that in the past, atemperature sensor was arranged at the suction nozzle 127 side and thesuction nozzle 127 was made to rotate by the rotary arm 48 shown in FIG.1, so it was necessary to provide a rotary contact connection terminaletc. in the middle of the electrical wiring from the temperature sensorand the wiring became more complicated.

[0146] Further, in a testing apparatus having a rotary arm type suctionhead 124, a plurality of rotary arms 48 are generally arranged aroundthe shaft 50 shown in FIG. 1. When attaching a temperature sensor to asuction nozzle 127 of a suction head 124 or the outer cylinder 127, anumber of temperature sensors corresponding to the number of suctionnozzles 1276 or outer cylinders 128 becomes necessary. As opposed tothis, in the tester according to the present embodiment, it issufficient to provide a number of temperature sensor 190 correspondingto the number of sockets 120 in which IC chips 122 are mounted, so it ispossible to reduce the number of the temperature sensors 190.

[0147] Fourth Embodiment

[0148] As shown in FIG. 6, in this embodiment, instead of the contacttype temperature sensor 190 shown in FIG. 5, a non-contact typetemperature sensor 190 a such as a radiation thermometer using infraredrays etc. is arranged. The rest of the structure is similar to that ofthe tester according to the embodiment shown in FIG. 5. Common membersare assigned common reference numerals and common portions of theexplanations are omitted.

[0149] As shown in FIG. 6, the testing apparatus according to thisembodiment is exactly the same as the tester of the embodiment shown inFIG. 5 except for having the non-contact type temperature sensor 190 aand exhibits similar actions and effects.

[0150] Fifth Embodiment

[0151] As shown in FIG. 7, in this embodiment, instead of the coolingmedium passage 182 formed at the socket adapter 180 shown in FIG. 5 oralong with the same, a cooling medium blowing nozzle 192 (cooling mediumblowing means) for blowing a cooling medium toward the back (secondsurface) of the IC chip 122 is attached to the back of the socket 120.The cooling medium blowing nozzle 192 has a tube 194 connected to it. Acooling medium is fed from a not shown cooling medium generating means.The cooling medium can be blown from the nozzle 192 to the back of theIC chip 122.

[0152] The cooling medium generating means is not particularly limited,but for example in the case of a low temperature test, it may becomprised of a heat exchanger using liquid nitrogen for lowering thetemperature of the inside of the chamber 6 and a blower while in thecase of a high temperature test it may be comprised of a heat exchangerusing a heater or a cooling element and a blower.

[0153] The rest of the structure is similar to that of the testeraccording to the embodiment shown in FIG. 5. Common members are assignedcommon reference numerals and common portions of the explanations areomitted.

[0154] As shown in FIG. 7, the tester according to this embodiment isexactly the same as the testing apparatus of the embodiment shown inFIG. 5 except for having the blowing nozzle 192 for blowing a coolingmedium to the back of the IC chip 122, so exhibits similar actions andeffects as the third embodiment and improves the cooling efficiency ofthe IC chip 122.

[0155] Sixth Embodiment

[0156] As shown in FIG. 8, in this embodiment, instead of the coolingmedium passage 182 formed at the socket adapter 180 shown in FIG. 5 oralong with the same, a cooling medium blowing nozzle 192 a (coolingmedium blowing means) for blowing a cooling medium toward the sidesurfaces of the suction nozzle 127 and the outer cylinder 128 isarranged. The cooling medium blowing nozzle 192 a in this embodiment issecured on the socket adapter 180.

[0157] The cooling medium blowing nozzle 192 a has a tube 194 aconnected to it. A cooling medium is fed from a not shown cooling mediumgenerating means. The cooling medium generating means used is onesimilar to that illustrated in the third embodiment.

[0158] At the outer circumference of the outer cylinder 128 and/orsuction nozzle 127 to which the cooling medium from the cooling mediumblowing nozzle 192 a is blown is preferably formed heat exchange fins129 for raising the heat exchange efficiency and more quickly coolingthe outer cylinder 128 and/or suction nozzle 127.

[0159] The rest of the structure is similar to that of the testeraccording to the embodiment shown in FIG. 5. Common members are assignedcommon reference numerals and common portions of the explanations areomitted.

[0160] As shown in FIG. 8, the tester according to this embodiment isexactly the same as the tester of the embodiment shown in FIG. 5 exceptfor the formation of heat exchange fins 129 at the outer circumferenceof the outer cylinder 128 and blowing a cooling medium to the sidesurface of the outer circumference of the outer cylinder 128, soexhibits similar actions and effects as the third embodiment andexhibits the actions and effects explained below.

[0161] That is, a variety of components are arranged around the socket120 used in the testing of an IC chip 122 and it is often difficult toblow a cooling medium directly toward the IC chip 122. In the presentembodiment, the cooling medium is blown toward the side surface of theouter cylinder 128 to cool the IC chip 122 indirectly. At this time, byproviding heat exchange fins 129 or other projections or depressions atthe outer circumference of the outer cylinder 128, it is possible toincrease the heat exchange efficiency, cool the outer cylinder 128efficiently, and efficiently cool the IC chip 122 indirectly. In thepresent embodiment as well, it is possible to cancel out the effect ofthe heat generated by the IC chip 122 well and test the IC chip 122 at apredetermined temperature as prescribed in the specifications.

[0162] Note that as a modification of this embodiment, it is possiblenot to provide the cooling medium blowing nozzle 192 a or cooling mediumblowing passage 182 shown in FIG. 8, but to provide heat exchange fins129 and other projections or depressions at the outer circumference ofthe suction nozzle 127. When the heat generated by the IC chip 122 isnot that large, it is possible to cool the IC chip 122 even withradiation of heat by the projections or depressions.

[0163] Seventh Embodiment

[0164] As shown in FIG. 9, in this embodiment, terminals are formed overthe entire back of the IC chip 122. Corresponding to this, a largenumber of connection terminals 121 are arranged at the socket 120.Therefore, in this embodiment, there is no space to provide atemperature sensor 190 or 190 a at the socket 120 side. Accordingly, inthis embodiment, as shown in FIG. 9, a non-contact type temperaturesensor 190 b is arranged at the side (pusher side) of the suction nozzle127 and outer cylinder 128. This non-contact temperature sensor 190 b issecured to the socket adapter 180 and not secured to the suction nozzle127 and outer cylinder 128 and does not move along with them. Thedirection of measurement of temperature of this non-contact typetemperature sensor 190 b is toward the top surface (first surface) ofthe IC chip 122. The temperature of the IC chip 122 can be measuredwithout contact.

[0165] The rest of the structure is similar to that of the testeraccording to the embodiment shown in FIG. 5. Common members are assignedcommon reference numerals and common portions of the explanations areomitted.

[0166] As shown in FIG. 9, the tester according to this embodimentexhibits similar actions and effects as the third embodiment andexhibits the actions and effects explained below.

[0167] That is, when terminals of an IC chip 122 are arranged over theentire back (second surface) of the IC chip 122, a corresponding numberof connection terminals are arranged without intervening space at thesocket 120. In such a case, it is difficult to measure the temperatureof the IC chip 122 from the socket side. In the present embodiment, thetemperature of the surface of the pusher side of the IC chip 122 ismeasured by the non-contact type temperature sensor 190 b.

[0168] If using a non-contact type temperature sensor 190 b, there is noneed to secure it to the suction nozzle 127 or outer cylinder 128 andthere is no need to make it rotate by the rotary arm together with thesuction nozzle 127 and outer cylinder 128. Therefore, even in a testerhaving a rotary arm type suction head 124, the electrical wiring fromthe temperature sensor 190 b does not become complicated. In the testerof the present embodiment, a non-contact type temperature sensor 190 bis used to accurately measure the temperature of the IC chip 122 and acooling medium is blown on the IC chip 122 based on the measurementresults to cool the IC chip 122. Therefore, it is possible to cancel outthe effect of heat generated by the IC chip 122 well and test the ICchip 122 at a predetermined temperature as prescribed in thespecifications.

[0169] Eighth Embodiment

[0170] As shown in FIG. 10, in this embodiment, terminals are formedover the entire back of the IC chip 122. Corresponding to this, a largenumber of connection terminals 121 are arranged at the socket 120.Therefore, in this embodiment, there is no space to provide atemperature sensor 190 or 190 a at the socket 120 side. Accordingly, inthis embodiment, as shown in FIG. 9, a non-contact type temperaturesensor 190 c is arranged at the side (pusher side) of the suction nozzle127 and outer cylinder 128. This non-contact temperature sensor 190 c issecured to the socket adapter 180 and not secured to the suction nozzle127 and outer cylinder 128 and does not move along with them. Thedirection of measurement of temperature of this non-contact typetemperature sensor 190 c is toward the outer circumferential surface ofthe outer cylinder 128 (pusher). The temperature of the outer cylinder128 can be measured without contact.

[0171] The rest of the structure is similar to that of the testeraccording to the embodiment shown in FIG. 5. Common members are assignedcommon reference numerals and common portions of the explanations areomitted.

[0172] As shown in FIG. 10, the tester according to this embodimentexhibits similar actions and effects as the third embodiment andexhibits the actions and effects explained below.

[0173] That is, when terminals of an IC chip 122 are arranged over theentire back (second surface) of the IC chip 122, a corresponding numberof connection terminals are arranged without intervening space at thesocket 120. Further, the suction nozzle 127 and outer cylinder 128 arearranged above the socket, so even if a non-contact type temperaturesensor is used, it is often difficult to directly measure thetemperature from the top surface (first surface) of the IC chip 122.Therefore, in the present embodiment, the temperature of the outercylinder 128 is measured by the non-contact type temperature sensor 190c.

[0174] If using a non-contact type temperature sensor 190 c, there is noneed to secure it to the suction nozzle 127 or outer cylinder 128 andthere is no need to make it rotate by the rotary arm together with thesuction nozzle 127 and outer cylinder 128. Therefore, even in a testerhaving a rotary arm type suction head 124, the electrical wiring fromthe temperature sensor 190 c does not become complicated. In the testingapparatus of the present embodiment, rather than directly measure thetemperature of the IC chip 122, a non-contact type temperature sensor190 c is used to measure the temperature of the outer cylinder 128 so asto estimate the temperature of the IC chip 122 and thereby detect thetemperature rise due to heat generated by the IC chip 122. The IC chip122 contacts the outer cylinder 128, so if the IC chip 122 rises intemperature due to heat it generates, the temperature of the outercylinder 128 also rises. The temperature of the outer cylinder 128 andthe temperature of the IC chip 122, however, do not always match, so inorder to estimate the temperature of the IC chip 122 from the detectedtemperature of the outer cylinder 128, it is necessary to consider acorrection value found by experiments etc. for the detected temperatureof the outer cylinder 128 to estimate the temperature of the IC chip122.

[0175] In the present embodiment, a non-contact type temperature sensor190 c is used to measure the temperature of the outer cylinder 128, thetemperature of the IC chip 122 is accurately predicted from the detectedtemperature, and the cooling medium is blown on the IC chip 122 based onthe results so as to cool the IC chip 122. Therefore, it is possible tocancel out the effect of heat generated by the IC chip 122 well and testthe IC chip 122 at a predetermined temperature as prescribed in thespecifications.

[0176] Modifications of Third to Eighth Embodiments

[0177] In the above embodiments, the explanation was given of the caseof an IC chip testing apparatus mainly conducting low temperature tests,but it is also possible to use the tester of the present invention toconduct ordinary temperature tests of electronic devices. In such acase, the test chamber and the temperature controller attached inside itmay be eliminated. If it is possible to control the IC chip 122 to thepredetermined ordinary temperature by just the cooling medium blowingpassage 82, cooling medium blowing nozzle 192 or 192 a, or other coolingmedium blowing means even without the test chamber and internaltemperature controller, the chamber and internal temperature controllerbecome unnecessary.

[0178] When conducting low temperature tests on an IC chip 122, however,if just holding the IC chip 122 in a low temperature state, condensationsometimes becomes a problem, so it is desirable to use a test chamber tocover the area around the test stage and keep the ambient temperatureinside the chamber at a predetermined low temperature state.

[0179] Further, when testing an IC chip 122 at a high temperature, thepresent invention is effective from the viewpoint of control of thetemperature of the IC chip 122 so that it does not exceed apredetermined temperature.

[0180] Ninth Embodiment

[0181] The overall configuration of the device testing apparatusaccording to this embodiment is not particularly limited. It may be thatof the device testing apparatus 2 shown in FIG. 1 or may be that of thedevice testing apparatus 1001 shown in the later explained FIG. 13.

[0182] As shown in FIG. 11 and FIG. 12, in the device testing apparatusof the present embodiment, a suction head (pusher) 304 c is attached toa not shown Z-axial direction drive unit. The suction head 304 c has apusher base moving up or down with respect to a contact portion 302 aand a movable base attached to the pusher base through a floatingmechanism. This movable base has secured to it a suction head body 304 c10 having a suction pad 304 c 2 for picking up an IC chip.

[0183] The suction head body 304 c 10 secured to the movable base (notshown) is formed with a through hole 304 c 11 for evacuation of theinside. Further, a suction pad 304 c 2 comprised of rubber or anotherelastic member is secured to the inside of the suction head body 304 c10. The suction force at the time of evacuation is imparted to the tipof the suction pad 304 c 2.

[0184] In particular, the suction head body 304 c 10 of the presentembodiment has a temperature sensor 304 c 12 buried in it near thesuction pad 304 c 2. The output side terminal 304 c 13 (hereinafterreferred to as the “first terminal”) is provided via the cable 304 c 14exposed from the suction head body 304 c 10 toward the bottom. The firstterminal 304 c 13 is comprised to be able to project or retract by aspring or other elastic member provided inside and is designed not to bedamaged even if approaching and striking the later explained secondterminal 302 b 1.

[0185] An air blower unit 302 b comprised of a metal block is providedaround the contact portion 302 a of the test head 302. The air blowerunit 302 b has formed in it a cooling air passage 302 b 2 through whichthe cooling air is guided. The cooling air blown from the outlet of thecooling air passage, as shown in FIG. 12, flows toward the IC chip inthe middle of the test from substantially straight at the side.

[0186] Note that a height adjustment block 302 b 3 is interposed betweenthe air blower unit 302 b and the test head 302. Even if the heightpositions of IC chips differ due to the different shapes of the contactportions 302 a, by selecting the thickness of the height adjustmentblock 302 b 3, it is possible to blow the cooling air from straightlaterally to the IC chips at all times. Due to this, it is possible todissipate the heat generated during the testing of IC chips.

[0187] Further, a second terminal 302 b 1 is provided on the top surfaceof the air blower unit 302 b at a position corresponding to the abovefirst terminal 304 c 13. The output signal from the temperature sensor304 c 12 is sent through the cable 304 c 14, first terminal 304 c 13,and second terminal 302 b 1 to a not shown controller.

[0188] When the solder ball terminals HB of an IC chip are pushedagainst the contact pins 302 a 1 of the contact portion 302 a, the firstterminal 304 c 13 contacts the second terminal 302 b 1, so thetemperature sensor 304 c 12 is used to detect the temperature of the ICchip and send it to the not shown controller. The controller, receivingthe temperature data, judges how much the temperature of the IC chip isoff from the target temperature and, when higher in temperature, blowscooling air from the cooling air passage 302 b 2 as shown in FIG. 12 tocool the IC chip. Due to this, it is possible to cool an IC chip even ifgenerating heat.

[0189] In the present embodiment, even if the temperature sensor 304 c12 is provided at the suction head 304 c, the cable of the temperaturesensor 304 c 12 will not break due to movement of the suction head 304 cand as a result it is possible to accurately measure the heat generatedduring a test.

[0190] In addition to this, it is possible to blow a sufficient amountof cooling air based on the measured temperature of the IC chip and, asa result, possible to prevent the electronic device from being destroyedor damaged by overheating, considered a particular problem in hightemperature tests. Further, since the temperature rise due to heatgenerated is suppressed by blowing a fluid, not limited to hightemperature tests, it is possible to conduct tests at the targetedaccurate temperature, so the reliability of the test results isimproved.

[0191] 10th Embodiment

[0192] As shown in FIG. 13, the device testing apparatus 1001 of thepresent embodiment tests (inspects) whether an IC is operating suitablyin a state applying a high temperature or low temperature thermal stressto the IC chip and classifies the ICs in accordance with the testresults. The operating test in the state with thermal stress applied isperformed by reloading the IC chips from a tray carrying a large numberof IC chips under test (hereinafter also called the “customer tray KST”,not shown) to a test tray TST (see FIG. 15) conveyed through the insideof the device testing apparatus 1001.

[0193] Therefore, the device testing apparatus 1001 of the presentembodiment, as shown in FIG. 13 and FIG. 14, is comprised of an ICmagazine 1200 which holds the IC chips to be tested or classifies andstores the tested IC chips, a loader section 1300 which sends the ICchips from the IC magazine 1200 into the chamber section 1100, a chambersection 1100 including a test head, and an unloader section 1400classifying and taking out tested IC chips which had been tested in thechamber section 1100.

[0194] IC Magazine 1200

[0195] The IC magazine 1200 is provided with a pre-test IC stocker 1201for holding IC chips to be tested and a post-test IC stocker 1202 forholding IC chips classified in accordance with the test results.

[0196] These pre-test IC stocker 1201 and post-test IC stocker 1202 areeach comprised of a frame-shaped tray support frame 1203 and an elevator1204 able to enter from under the tray support frame 1203 and movetoward the top. The tray support frame 1203 supports in it a pluralityof stacked customer trays KST. Only the stacked customer trays KST aremoved up and down by the elevator 1204.

[0197] The pre-test IC stocker 1201 holds stacked customer trays KST onwhich the IC chips to be tested are held, while the post-test IC stocker1202 holds stacked customer trays KST on which IC chips finished beingtested are suitably classified.

[0198] Note that since the pre-test IC stocker 1201 and the post-test ICstocker 1202 are structured the same, the numbers of the pre-test ICstocker 1201 and the post-test IC stocker 1202 may be suitably set inaccordance with need.

[0199] In the example shown in FIG. 13 and FIG. 14, the pre-test stocker1201 is provided with two stockers STK-B and provided next to that withtwo empty stockers STK-E to be sent to the unloader section 1400, whilethe post-test IC stocker 1202 is provided with eight stockers STK-1,STK-2, . . . , STK-8 and can hold ICs sorted into a maximum of eightclasses according to the test results. That is, in addition toclassifying ICs as good and defective, it is possible to divide the goodICs into ones with high operating speeds, ones with medium speeds, andones with low speeds and the defective ICs into ones requiring retestingetc.

[0200] Loader Section 1300 The above-mentioned customer tray KST isconveyed from the lower side of the test board 1105 to a window 1306 ofthe loader section 1300 by a tray transfer arm 1205 provided between theIC magazine 1200 and test board 1105. Further, in the loader section1300, the IC chips loaded on the customer tray KST are transferred onceto a preciser 1305 by the X-Y-conveyor 1304. There, the mutual positionsof the IC chips are corrected, then the IC chips transferred to thepreciser 1305 are reloaded on the test tray TST stopped at the loadersection 1300 using the X-Y conveyor 1304 again.

[0201] The IC conveyor 1304 reloading the IC chips from a customer trayKST to the test tray TST, as shown in FIG. 13, is provided with tworails 1301 laid over the top of the test board 1105, a movable arm 1302able to move back and forth (this direction designated as theY-direction) between the test tray TST and a customer tray KST by thesetwo rails 1301, and a movable head 1303 supported by the movable arm1302 and able to move in the X-direction along the movable arm 1302.

[0202] The movable head 1303 of the X-Y conveyor 1304 has suction headsattached facing downward. The suction heads move while drawing out airto pick up the IC chips from the customer tray KST and reload the ICchips on the test tray TST. For example, about eight suction heads areprovided on the movable head 1303, so it is possible to reload eight ICchips at one time on the test tray TST.

[0203] Chamber Section 1100

[0204] The above-mentioned test tray TST is conveyed into the chambersection 1100 after being loaded with the IC chips by the loader section1300, then the IC chips are tested in a state carried on the test trayTST.

[0205] The chamber section 1100 is comprised of a constant temperaturechamber 1101 for giving a desired high temperature or low temperaturethermal stress to the IC chips loaded on the test tray TST, a testchamber 1102 for making the IC chips contact the test head in a stategiven the thermal stress by the constant temperature chamber 1101, and asoak chamber 1103 for removing the given thermal stress from the ICchips tested in the test chamber 1102.

[0206] In the soak chamber 1103, when a high temperature was applied inthe constant temperature chamber 1101, the IC chips are cooled byblowing in air to return them to room temperature. Alternatively, when alow temperature of about −30° C. has been applied in the constanttemperature chamber 1101, it heats the IC chips by hot air or a heateretc. to return them to a temperature where no condensation occurs. Next,the thus treated IC chips are conveyed out to the unloader section 1400.

[0207] As shown conceptually in FIG. 14, the constant temperaturechamber 1101 is provided with a vertical conveyor. A plurality of testtrays TST stand by supported by the vertical conveyor until the testchamber 1102 becomes empty. While standing by, a high temperature or lowtemperature thermal stress is applied to the IC chips.

[0208] The test chamber 1102 has a test head 1104 arranged at itscenter. A test tray TST is conveyed above the test head 1104 and the ICchips are tested by bringing their input-output terminals HB intoelectrical contact with the contact pins 151 of the test head 1104. Onthe other hand, the test tray TST finished being tested is treated inthe soak chamber 1103 to return the temperature of the ICs to roomtemperature, then is ejected to the unloader section 1400.

[0209] The test board 1105 has a test tray conveyor 1108 mounted on it.The test tray TST ejected from the soak chamber 1103 by the test trayconveyor 1108 is returned to the constant temperature chamber 1101through the unloader section 1400 and the loader section 1300.

[0210]FIG. 15 is a disassembled perspective view of the structure of atest tray TST used in the present embodiment. The test tray TST iscomprised of a rectangular frame 1012 provided with a plurality ofcrosspieces 1013 in parallel at equal intervals and has a plurality ofmounting pieces 1014 formed projecting out at equal intervals at the twosides of these crosspieces and the sides 1012 a of the frame 1012 facingthe crosspieces. Insert holders 1015 are comprised between thesecrosspieces, between the crosspieces 1013 and the sides 1012 a, and thetwo mounting pieces 1014.

[0211] The insert holders 1015 are designed to receive one insert 1016each. An insert 1016 is attached to the two mounting pieces 1014 in afloating state using fasteners 1017. Therefore, mounting holes 1021 tothe mounting pieces 1014 are formed at the two ends of the inserts 1016.For example, about 16×4 of these inserts 1016 are provided in one testtray TST.

[0212] Note that the inserts 1016 are made the same shape and samedimensions and that the IC chips are received in the inserts. The ICholder 1019 of the insert 1016 is determined by the shape of the IC chipto be received and in the example shown in FIG. 15 is made a rectangularindentation.

[0213] Here, if the IC chips once connected to the test head 1104 arearranged in four rows and 16 columns as shown in FIG. 15, then forexample four rows of four columns of IC chips are simultaneously tested.That is, in the first test, the 16 IC chips arranged every fourth columnfrom the first column are tested connected to the contact pins 1051 ofthe test head 1104. In the second test, the test tray TST is moved onecolumn's worth and the IC chips arranged every fourth column from thesecond column are similarly tested. By doing this a total of four times,all of the IC chips are tested. The present invention, however, is notlimited to this. There is no need to attach inserts 1016 to all of thecolumns and rows. It is possible to select the attachment positions ofthe inserts 1016 in accordance with the test specifications. The resultsof the test are stored at addresses determined by for example theidentification number assigned to the test tray TST and the numbers ofthe IC chips assigned inside the test tray TST.

[0214] As shown in FIG. 20, a Z-axial drive (part of pusher) 1060 isprovided at the top side of the test head 1104 and is moved verticallyin the Z-direction by for example a fluid pressure cylinder. Matchplates (part of pushers) 1061 shown in FIG. 19 are attached at thebottom side of the Z-axial drive 1060. The match plates 1061 aresupported by the Z-axial drive 1060 so as to be raised and lowered alongwith the Z-axial drive 1060.

[0215] The match plate 1061 is provide with a pusher (part of pusher)1030 shaped in accordance with the specifications of the IC chipscorresponding to the intervals of the IC chips under test at one time asshown in FIG. 19.

[0216]FIG. 16 and FIG. 17 show a pusher 1030. This pusher 1030 has alead pusher base 1035 and pusher base 1034 attached to the above matchplate 1061 and moving vertically in the Z-axial direction along with theZ-axial drive 1060 and a pusher block 1031 attached to the pusher base1034 via two springs (corresponding to elastic members) 1036, 1036.

[0217] The lead pusher base 1035 and the pusher base 1034 are bolted asshown in FIG. 17. At the two sides of the pusher base 1034 are providedguide pins 1032 to be inserted into guide holes 1020 of the insert 1016mentioned later and guide bushes 1041 of the socket guide 1040. Further,the pusher base 1034 is provided with stopper guides 1033 for limitingthe descent of the pusher base 1034 along with the Z-axial drive 1060 asa lower limit. The stopper guides 1033 abut against the stopper surface1042 of the socket guide 1040 to determine the standard dimensions ofthe lower limit position of the pusher for pushing by a suitablepressure not breaking the IC chip.

[0218] As shown in FIG. 17 and FIG. 18, the pusher block 1031 is forexample made of aluminum or copper. It is inserted in a through holemade in the center of the pusher base 1034 with springs 1035, 1036 and,if necessary, shims (not shown) interposed with the lead pusher base1035. The springs 1036, 1036 are compression springs (elastic members)giving a spring bias to the pusher block 1031 in the downward directionin the figure (direction going toward IC chip) and have elasticcoefficients in accordance with a reference load on the IC chips.

[0219] The shim inserted in accordance with need along with the springs1036 adjusts the reference length in the mounted state of the springs1036 to adjust the initial load acting on the pusher block 1031. Thatis, even when using springs 1036 of the same elastic coefficient, theinsertion of the shim makes the initial load acting on the pusher block1031 larger. Note that it is sufficient to be able to adjust thestandard length of the springs 1036, so the position of insertion of theshim may be between a spring 1036 and pusher block 1031 or between thelead pusher base 1035 and a spring 1036.

[0220] Between the two springs 1036, 1036 and on the top surface of thepusher block 1031 is secured for example an aluminum heat sink 1038superior in heat conductivity. This heat sink 1038 abuts planarlyagainst the top surface of the pusher block 1031 and is formed with heatradiating fins with large surface areas on its opposite side. The pusherblock 1031 is made of aluminum or copper with superior heatconductivities and directly contacts the IC chip, so absorbs the heatgenerated by the ICs occurring during testing as it is. The heatconducted to the pusher block 1031 is absorbed by the heat sink 1038 andradiated to the surroundings from the heat radiating fins so as toprevent destruction or damage to the IC chips due to the heat generatedby the IC chips or fluctuations in the temperature conditions.

[0221] The insert 1016, as explained also in FIG. 15, is attached to thetest tray TST using a fastener 1017. It is formed at its two sides withguide holes 1020 through which the above-mentioned guide pins 1032 ofthe pusher 1030 and the guide bushes 1041 of the socket guide 1040 areinserted. While a detailed illustration is omitted, for example theupper half of the guide hole 1020 at the left side is made a smalldiameter hole where the guide pin 1032 of the pusher base 1034 isinserted for positioning. The lower half of the guide hole 1020 is madea large diameter hole where the guide bush 1041 of the socket guide 1040is inserted for positioning. Note that the guide hole 1020 at the rightside in FIG. 17 fits loosely with the guide pin 1032 of the pusher base1034 and the guide bush 1041 of the socket guide 1040.

[0222] As shown in FIG. 16 and FIG. 17, the insert 1016 is formed at itscenter with an IC holder 1019. By dropping the IC chip here, the IC chipis loaded on the test tray TST.

[0223] On the other hand, the socket guide 1040 fixed to the test head1104 is provided at its two sides with guide bushes 1041 for insertionof the two guide pins 1032 of the pusher base 1034 and positioning withthese two guide pins 1032. The guide bush 1041 at the left side alsoperforms positioning with the insert 1016.

[0224] At the lower side of the socket guide 1040 is fixed a socket 1050having a plurality of contact pins 1051. These contact pins 1051 arebiased in the upward direction by not shown springs. Therefore, even ifpushing an IC chip, the contact pins 1051 will retract to the topsurface of the socket 1050. On the other hand, it is possible for thecontact pins 1051 to contact all of the IC terminals even if the IC chipis pushed somewhat at an angle.

[0225] Unloader Section 1400 As shown in FIG. 13, the unloader section1400 is provided with X-Y conveyors 1404, 1404 of the same structure asthe X-Y conveyor 1304 provided at the loader section 1300. The X-Yconveyors 1404, 1404 reload the tested IC chips from the test tray TSTcarried out to the unloader section 1400 to the customer tray KST.

[0226] As shown in FIG. 13, the test board 1105 of the unloader section1400 is provided with two pairs of windows 1406, 1406 arranged so thatthe customer trays KST carried to the unloader section 1400 can bebrought close to the top surface of the test board 1105.

[0227] Further, while not illustrated, elevator tables for elevating orlowering customer trays KST are provided below the windows 1406. Acustomer tray KST becoming full after being reloaded with the tested ICchips is placed on there and lowered and the full tray is passed to thetray transfer arm 1205.

[0228] Note that in the device testing apparatus 1001 of the presentembodiment, while there are a maximum of eight types of sortablecategories, it is only possible to arrange a maximum of four customertrays KST at the windows 1406 of the unloader section 1400. To make upfor this, a buffer section 1405 is provided between the test tray TSTand the window 1406 of the unloader section 1400, and IC chips of acategory rarely appearing are stored temporarily at this buffer section1405.

[0229] The mode of operation will be explained next.

[0230] In the test process inside the chamber section 1100, the IC chipsare conveyed to above the test head 1104 in the state carried on thetest tray TST shown in FIG. 15, more specifically the individual ICchips are conveyed in the state dropped into the IC holders 1019 of theinserts 1016 of the figure.

[0231] When the test tray TST stops at the test head 1104, the Z-axialdrive starts to operate and each pusher 1030 descends with respect toeach insert 1016. The two guide pins 1032, 1032 of the pushers 1030formed at the bottom surface of the pusher base 1034 pass through theguide holes 1020, 1020 of the inserts 1016 and engage with the guidebushes 1041, 1041 of the socket guides 1040.

[0232] This state is shown in FIG. 17 and FIG. 18. The inserts 1016 andthe pushers 1030 have a certain degree of positional error with respectto the sockets 1050 and socket guides 1040 fixed to the test head 1104(that is, the device testing apparatus 1001 side). The guide pins 1032of the left side of the pusher bases 1034 are fit into the smalldiameter holes of the guide holes 1020 of the inserts 1016 forpositioning the pushers 1030 and the inserts 1016, so as a result it ispossible for the pusher blocks 1031 attached to the pusher bases 1034 topush the IC chips at suitable positions in the X-Y direction.

[0233] Further, the large diameter holes of the guide holes 1020 at theleft sides of the inserts 1016 engage with the guide bushes 1041 of theleft sides of the socket guides 1040, whereby the inserts 1016 and thesocket guides 1040 are positioned with respect to each other and wherebythe positioning accuracy of the IC chips and the contact pins 1051 isimproved in the X-Y direction.

[0234] Further, when the IC chips held by the IC holders 1019 of theinserts 1016 are pushed by the pushers 1030, they are drawn into thedevice guides 1052 provided at the socket 1050 or the socket guide 1040for positioning, so positioning of the input-output terminals andcontact pins 1051 in the X-Y direction can be realized with a highprecision.

[0235] As opposed to this, for the Z-axial direction, the load acting onthe IC chip when the stopper guide 1033 of the pusher base 1034 and thestopper surface 1042 of the socket guide 1040 abut becomes a problem. Iftoo large, it leads to damage to the IC chip, while if too small, thetest cannot be performed. Accordingly, it is necessary to precisely setthe distance Y in the Z-axial direction between the stopper guide 1033of the pusher base 1034 and the pusher block 1031 and the distance Z inthe Z-axial direction between the contact pins 1051 and the stoppersurface 1042 of the socket guide 1040. These is however a limit to thisas well. Further, the thickness X of the IC chip itself has a largeeffect.

[0236] In the device testing apparatus 1001 of the present embodiment,however, the stroke of the pusher is not controlled. Rather, the loaddue to the pusher block 1031 is controlled, thereby enabling the pushingforce on the IC chip to be made uniform. That is, even if errors ΔX, ΔY,and ΔZ occur in the reference dimensions X, Y, and Z, the pusher block1031 imparts elasticity to the IC chip due to the action of the springs1036, 1036 and absorbs these errors. Therefore, it is possible toprevent an excessive pushing force from acting on the IC chip orconversely the pushing force from becoming insufficient.

[0237] Further, in addition to this load management, in the presentinvention, the pusher base 1031 is provided with a heat sink 1038, soeven if an IC generates heat on its own during testing, the heat isabsorbed by the heat sink 1038 and discharged from there to thesurrounding environment, so it is possible to prevent destruction ordamage of the IC due to overheating, considered a particular problem inhigh temperature tests. Further, since the temperature rise due to theheat generated is suppressed by the heat absorbing and radiating effectof the heat sink 1038, not only for high temperature tests, it ispossible to test IC chips at the targeted accurate temperature and thereliability of the test results is improved.

[0238] Further, as shown in FIG. 16, FIG. 17, and FIG. 20, since thedirection of the air acts well on the heat sink 1038 in the test chamber1102, the heat radiating effect becomes better.

[0239] 11th Embodiment

[0240] The device testing apparatus according to the present embodimentis substantially identical to the device testing apparatus 1001according to the 10th embodiment, but differs in the number of ICsmeasured at the test head. Along with this, the shapes of the matchplate 1061 and the pushers 1030 differ. Further, the shape of the heatsink 1038 provided at the pusher base 1031 differs.

[0241] That is, while there were 2 rows×8 columns of ICs in the matchplate 1061 of the 10th embodiment, there are 4 rows×8 columns of ICs inthe present embodiment as shown in FIG. 22 and FIG. 23. Therefore, apusher 1030 has to be made about half the size of that shown in FIG. 16,so the heat sinks 1038 are provided at the two sides of a spring 1036.

[0242] In this embodiment as well, the pusher block 1031 is made ofaluminum or copper superior in heat conductivity and the IC chip isdirectly contacted with, so the heat generated by the IC caused duringtesting is absorbed as it is and the heat conducted to the pusher block1031 is absorbed by the heat sink 1038. By dissipating this from theheat-radiating fins to the surroundings, it is possible to prevent thedestruction or damage of an IC chip due to the heat generated by the ICor fluctuations in the temperature conditions.

[0243] 12th Embodiment

[0244] The device testing apparatus according to the present embodimentis substantially identical to the device testing apparatus 1001according to the 10th embodiment, but as shown in FIG. 24 and FIG. 25,in the present embodiment, the pusher block 1031 is secured to thepusher base 1034 and, therefore, springs 1036, 1036 are interposedbetween the pusher 1035 a of the lead pusher base 1035 and the pusherbase 1034. That is, the pusher 1035 a is designed to be able to move inthe Z-axial direction with respect to the lead pusher base 1035.

[0245] Further, the dimensions are set so that, at the bottom dead pointposition of the Z-axial drive 1060, the stopper guide 1033 of the pusherbase 1034 and the stopper surface 1042 of the socket guide 1040 do notabut. The bottom dead point position of the Z-axial drive 1060 isdetermined by the abutting of the frame of the Z-axial drive 1060 andthe stopper post 1104 a of the test head.

[0246] Therefore, if the Z-axial drive 1060 is made to descend and topush the pusher 1035 a of the pusher base 1035 by its pusher 1062, theIC chip receives an upward force from the contact pin 1051 and receivesa downward force due to the springs 1036. By adjusting the balancebetween the two, it is possible to adjust the load acting on the IC chipto a suitable value.

[0247] In this embodiment, the pusher block 1031 can be formedintegrally with the pusher base 1034, so the heat sink 1038 ispreferably attached to the top surface of the pusher base 1034. Due tothis, the heat generated by the IC caused during testing is conductedthrough the pusher block 1031 and the pusher base 1034 to the heat sink1038 and radiated off from there to the surroundings, so it is possibleto prevent destruction or damage to the IC chip due to heat generated bythe IC or fluctuations in the temperature conditions.

[0248] Note that the heat sink 1038 may be formed integrally with thepusher base 1034.

[0249] In particular, in the present embodiment, what contacts the ICchip are members with a large heat mass such as the pusher block 1031and the pusher base 1034, so it is possible to sufficient dissipate theheat even if the IC chip is one with a remarkably large amount of heatbuildup.

[0250] Further, in the present embodiment, for example, by interposing aPeltier element between the pusher block 1031 and the heat sink 1038 andsending a current of a predetermined direction in accordance with the ICtemperature through the Peltier element, it is possible to realizesuitable temperature control.

[0251] 13th Embodiment

[0252] The overall configuration of the device testing apparatus of thepresent embodiment is substantially identical to that of the devicetesting apparatus 1001 according to the 10th embodiment, but differs inthe following point.

[0253] In the present embodiment, as shown in FIG. 27, a plurality ofthrough holes 2122 (hereinafter referred to as second through holes) areformed in the pushers 2121 of the match plate 2120. Further, as shown inFIG. 26, a plurality of through holes 2112 (hereinafter referred to asfirst through holes) are formed at the position of the Z-axial drive2110 positioned directly above the match plate 2120. The shapes,quantities, and positions of the first and second through holes 2112 and2122 are not particularly limited. In the present embodiment, as shownin FIG. 27, one second through hole 2122 is formed so as to besurrounded by four pushers 2121. The second through holes 2122 areformed so as to be positioned substantially equally in the match plate2120 as a whole.

[0254] Further, as shown in FIG. 26, the top corner part of the testchamber 2102 (or to the soak chamber) is provided with a temperatureapplication unit 2130. Inside of the unit 2130 are provided a heater2131 for applying a high temperature, a blowing nozzle 2132 for liquidnitrogen for applying a low temperature, and a scroll fan 2133 forsupplying hot air or cooling air inside of the chamber 2102. Further,the unit 2130 has formed with a feed port 2134 and intake port 2135 sothat the hot air or cold air flows down as shown by the white arrow inthe figure.

[0255] In this embodiment, a flow of hot air or cold air or other gas isfed from the temperature application unit 2130. When this flow of gasflows along the ceiling surface of the test chamber 2102 as shown inFIG. 26, part passes through the first through holes 2112 formed in theZ-axial drive 2110 and the second through holes 2122 formed in the matchplate 2120 and blows on to the heat sink or IC chip directly. The restof the flow of the gas sneaks around along the right side wall of thetest chamber 102 and passes through the gap between the match plate 2120and the test tray TST to return to the intake port 2135 of the unit2130.

[0256] That is, in the device testing apparatus of the presentembodiment, the hot air or cold air or other gas flow blown out from thefeed port 2134 of the temperature application unit 2130 can be blown inparallel to the plurality of IC chips under test carried planarly, sothe amount of heat supplied to the IC chips under test becomes uniformand the temperature elevation or reduction time for the plurality of ICchips under test becomes uniform. Due to this, it is possible to preventuneven temperature from occurring even if 64 IC chips are carried and asa result possible to shorten the temperature elevation or reductiontime. Further, it is possible to avoid unevenness of the temperaturedistribution due to heat generated by the IC chip.

[0257] 14th Embodiment

[0258] The overall configuration of the device testing apparatus of thisembodiment is substantially identical with that of the device testingapparatus 1001 according to the 10th embodiment, but differs in thefollowing point.

[0259] As shown in FIG. 28, in this embodiment, a nozzle 3000 isprovided between the pair of pushers 3062 provided at the bottom surfaceof the Z-axial drive 3060. The nozzle 3000 is formed with a channel 3002through which a temperature control gas (for example, cooling air)circulates and a pair of blowing ports. Temperature control gas is blownout from the blowing ports toward heat sinks 3038 provided on the pusherbase 3034 connected to the lead pusher base 3035 held at the match plate3061.

[0260] The temperature control gas may be a flow of gas of the sametemperature as the flow of gas circulating in the chamber formaintaining the IC chips at the test temperature, but may also be a flowof gas of a different temperature. The temperature control gas ispreferably cooling air for reducing the temperature rise due to the heatgenerated by the IC chip.

[0261] In this embodiment, in the same way as the 10th embodiment, thepusher block 3031 is comprised of aluminum or copper having a superiorheat conductivity and directly contacts the IC chip held in the socket3050. Therefore, the amount of heat due to the heat generated by the ICchip during a test is conducted to the pressure block 3031 and conveyedfrom there through the pusher base 3034 or directly to the heat sink3038. The heat sink 3038 has temperature control gas (cooling air) blownon it from the blowing port of the nozzle 3000 and therefore isforce-cooled. Accordingly, heat is rapidly dissipated from theheat-radiating fins of the heat sink 3038 and it is possible toeffectively prevent the temperature of the IC chip from falling out ofthe test temperature range due to heat generated by the IC chip.

[0262] Note that the nozzle 3000 may also be provided at the match plate3061 rather than the Z-axial drive 3060.

[0263] Other Embodiments

[0264] Note that the present invention is not limited to the aboveembodiments. Various modifications may be made within the scope of thepresent invention.

[0265] For example, the devices tested by the device testing apparatusof the present invention is not limited to an IC chip and may be otherelectronic devices as well.

1. A device testing apparatus comprising: a connection terminal to whichan electronic device under test is detachably connected; a pusher forpushing the electronic device in the direction of the connectionterminal so as to connect the electronic device to the connectionterminal; and a cooling unit attached to the pusher for cooling theelectronic device.
 2. A device testing apparatus comprising: aconnection terminal to which an electronic device under test isdetachably connected and a cooling unit for directly or indirectlycooling the connection terminal.
 3. A device testing apparatuscomprising: a socket having a connection terminal to which an electronicdevice under test is detachably connection and a cooling unit fordirectly or indirectly cooling the socket.
 4. The device testingapparatus as set forth in claim 1, further comprising a chamber formaintaining a predetermined ambient temperature of the connectionterminal to which the electronic device is detachably attached.
 5. Thedevice testing apparatus as set forth in claim 1, wherein the coolingunit includes an element for cooling by electricity.
 6. The devicetesting apparatus as set forth in claim 1, wherein the cooling unitincludes a cooling medium blowing means for blowing a cooling mediumaround the electronic device.
 7. The device testing apparatus as setforth in claim 1, wherein the cooling unit includes projections ordepressions for heat exchange for increasing the cooling efficiency byblowing the cooling medium.
 8. The device testing apparatus as set forthin claim 7, wherein the projections or depressions for heat exchange areheat absorbing and radiating members.
 9. A device testing apparatuscomprising: a tray for testing while pushing terminals of a plurality ofelectronic devices carried on the tray against contact portions of atest head; a pusher for pushing each of the plurality of electronicdevices held on the tray in the direction of the contact portions; and aheat absorbing and radiating member provided at the pusher.
 10. Thedevice testing apparatus as set forth in claim 9, wherein the pushercomprises: a pusher base provided to be able to approach and move awayfrom a contact portion and a pusher block provided integrally orseparately from the pusher base and contacting an electronic device fromthe surface opposite to the contact portion to push the same.
 11. Thedevice testing apparatus as set forth in claim 9, wherein the heatabsorbing and radiating member is formed integrally with at least partof the pusher.
 12. The device testing apparatus as set forth in claim10, wherein the pusher block is configured separate from the pusher baseand further comprises an elastic member imparting elasticity in thepushing direction of the electronic device to the pusher block.
 13. Thedevice testing apparatus as set forth in claim 12, wherein the heatabsorbing and radiating member is provided between elastic members. 14.The device testing apparatus as set forth in claim 12, wherein heatabsorbing and radiating members are provided at the two sides of anelastic member.
 15. The device testing apparatus as set forth in claim9, wherein a flow of gas in the chamber for maintaining the electronicdevice at a predetermined temperature is blown against the heatabsorbing and radiating member.
 16. The device testing apparatus as setforth in claim 15, wherein the pusher is formed with a passage forguiding the flow of gas in the chamber for maintaining the electronicdevice at a predetermined temperature in the direction of the heatabsorbing and radiating member.
 17. The device testing apparatus as setforth in claim 9, wherein the pusher is formed with a nozzle for guidingtemperature control gas, separate from the gas flow in the chamber formaintaining the electronic device at a predetermined temperature, in thedirection of the heat absorbing and radiating member.
 18. A devicetester comprising: connection terminals to which an electronic deviceunder test is detachably connected; a pusher for pushing the electronicdevice in the direction of the connection terminals so as to connect theelectronic device to the connection terminals; a suction head having avacuum suction bore for adhering the electric device by suction, thesuction head being attached to the pusher; a cooling unit attached tothe suction head for cooling the electronic device; a temperature sensorfor measuring a temperature of the device; and a controller forcontrolling a cooling output of the cooling unit to cancel out heatgenerated by the electric device during tests and maintain the deviceconstantly at a predetermined temperature on the basis of a temperaturesignal output by the temperature sensor.
 19. The device tester as setforth in claim 18, further comprising a chamber for maintaining apredetermined ambient temperature of the connection terminal to whichthe electronic device is detachably attached.
 20. The device tester asset forth in claim 18, wherein the cooling unit includes an element forcooling by electricity.
 21. The device tester as set forth in claim 18,wherein the cooling unit includes a cooling medium blowing means forblowing a cooling medium around the electronic device.
 22. The devicetester as set forth in claim 18, wherein the cooling unit includesprojections or depressions for heat exchange for increasing coolingefficiency by blowing the cooling medium.
 23. The device tester as setforth in claim 22, wherein the projections or depressions for heatexchange are heat absorbing and radiating members.
 24. A device testercomprising: connection terminals to which an electronic device undertest is detachably connected; and a cooling fin for directly orindirectly cooling the connection terminals to cancel out heat generatedby the electric device during tests and maintain the device constantlyat a predetermined temperature.
 25. The device tester as set forth inclaim 24, further comprising a chamber for maintaining a predeterminedambient temperature of the connection terminal to which the electronicdevice is detachably attached.
 26. The device tester as set forth inclaim 24, where the cooling fin is a part of a cooling unit whichincludes an element for cooling by electricity.
 27. The device tester asset forth in claim 24, wherein the cooling fin is a part of a coolingunit which includes a cooling medium blowing means for blowing a coolingmedium around the electronic device.
 28. The device tester as set forthin claim 24, wherein the cooling fin increases cooling efficiency byblowing the cooling medium.
 29. The device tester as set forth in claim28, wherein the cooling fm is a heat absorbing and radiating member. 30.The device tester as set forth in claim 24, wherein a plurality of setsof cooling fins are provided.
 31. A device tester comprising: a sockethaving connection terminals to which an electronic device under test isdetachably connected; and a cooling fin for directly or indirectlycooling the socket to cancel out heat generated by the electric deviceduring tests and maintain the device constantly at a predeterminedtemperature.
 32. The device tester as set forth in claim 31, furthercomprising a chamber for maintaining a predetermined ambient temperatureof the connection terminal to which the electronic device is detachablyattached.
 33. The device tester as set forth in claim 31, where thecooling fin is a part of a cooling unit which includes an element forcooling by electricity.
 34. The device tester as set forth in claim 31,wherein the cooling fin is a part of a cooling unit which includes acooling medium blowing means for blowing a cooling medium around theelectronic device.
 35. The device tester as set forth in claim 31,wherein the cooling fin increases cooling efficiency by blowing thecooling medium.
 36. The device tester as set forth in claim 35, whereinthe cooling fin is a heat absorbing and radiating member.
 37. The devicetester as set forth in claim 31, wherein a plurality of sets of coolingfins are provided.